Eulex | High Frequency Ceramic

Eulex (formerly Quantic Eulex) pioneered an embedded-electrode RF capacitor architecture that delivers an order-of-magnitude increase in capacitance density with ultra-low parasitics. The result is broadband, ultra-low-loss, high-power performance across decades of frequency—ideal for DC blocking, decoupling, and impedance matching. The technology is compatible with standard surface-mount assembly processes, improving reliability, simplifying manufacturing, and reducing (or eliminating) tuning.

Location: 718 Monterey Pass Rd., Monterey Park, CA 91754; Tel +1 323.266.6603

  • AI data centers & high-speed compute architecture
  • Advanced broadband & RF systems
  • Automotive: mmWave radar, vision sensing & C-V2X
  • Military & aerospace: radar, satcom & EW
  • Optical transceivers & photonics modules
  • Test & measurement / ATE

XG1 Series- Binary 

  • 20x capacitance
  • Wire-bondable
  • Additional Capacitor on Device
  • Configurable Design

XG1 Datasheet

XG2 Series - 2 Terminal  

  • Low insertion loss with ultra-high self-resonant frequencies
  • Ultra-stable, high-Q materials with extremely high self-resonance
  • Useful capacitance values far exceeding other manufacturers Mountable across the microstrip to eliminate bond-wire inductance
  • Supports key RF functions including DC Blocking, RF bypass, impedance matching, filtering, tuning and coupling
 XG2 Datasheet

XG3 Series - 3 Terminal  

  • Ultra-thin, single-layer design minimizes ESL
  • Optimized for high-frequency, ultra-stable performance
  • Eliminates wire bonding
  • Combines SLC-like high frequency with very low mounting inductance  improving bypassing/filtering/noise suppression results
  • Surface-mountable package
XG3 Datasheet

XQ Series - Ultra-High Q

  • Size 01005 thru 1111
  • 0.1pF to 1000pF
  • 6.3V - 1500V
  • NPO dielectric (±30ppm / °C)
Ultra-High Q Datasheet

XV Series - Vertical Layer

  • Miniature Form Factor  (1515-5080)
  • Wire-bondable, Au Terminations
  • Class II (-55°C to 125°C) X7R
  • Ideal for decoupling bare die
Vertical Datasheet

Substrates

  • High Purity Alumina
  • High Q dielectrics 
  • AlN with Exceptional Thermal Conductivity
  • Thin Film Metallization (Au, TaN, AuSn)
  • Custom size & shape