XG3 Series
Product Series Specifications
| General Parameters | |
|---|---|
| Type: | RF Ceramic - Single-layer SMD Mount Gap Capacitor |
| Grade: | Hi-Rel/ Mission-critical RF and microwave component |
| Dielectric/Construction: | Porcelain, Class I NPQ, Class I NP0, Class I NPS, Class II X7R, and Class III Y5V |
| Rated Voltage: | 6.3V to 100V |
| Capacitance: | 0.5 pF to 100, 000 pF |
| Sizes: | 1809, 1707, 1507, 0602, 0502, and 0301 |
| Operating Temp: | -55 °C to +125 °C |
Overview
The XG3 series is a single-layer SMD terminal gap capacitor with Pt or Au metallization for solder or epoxy die attach. It is offered in multiple dielectric families, voltage ratings, capacitance tolerances, and compact case sizes, and includes a three-pad terminal configuration shown in the part-numbering system and pinout schematic.
Additional Features
- 3-terminal design
- Novel embedded-electrode capacitor design eliminates wire bonds and vias
- Extremely low ESL (typically <15pH)
- Low ESR enables high power handling
- Large capacitance achievable in reasonable size
- Broadband performance from kHz to 10s of GHz
- 1 XG3 capacitor can replace 10s of MLCC
Typical Applications
- RF and microwave circuits
- High-frequency coupling and tuning networks
- Precision impedance matching applications
- DC Blocking, RF bypass
- For DC Bias line filtering/EMI filtering
