Ultra-low parasitic RF capacitors engineered for high-frequency, microwave, and high-reliability applications.
The Eulex XG Series is a family of advanced RF ceramic capacitors engineered specifically for high-frequency and microwave applications where conventional capacitor technologies become limited by parasitic inductance, ESR, and self-resonant frequency behavior.
Built on Eulex embedded-electrode technology, XG capacitors deliver ultra-low ESL, broadband RF performance, high reliability, and stable operation across demanding aerospace, defense, AI infrastructure, SATCOM, radar, and electronic warfare systems.
The XG family includes multiple configurations optimized for different RF design challenges, from precision tuning and coupling applications to ultra-low inductance broadband filtering and power integrity applications.
Why XG Technology Matters
Conventional capacitors become increasingly limited at high frequencies.
As operating frequencies rise, parasitic inductance and ESR begin to dominate component behavior, impacting:
• RF signal integrity
• Power distribution network stability
• Impedance matching
• EMI suppression
• Broadband filtering performance
• High-speed transient response
Eulex XG capacitors utilize a novel embedded-electrode architecture designed to minimize parasitics while extending stable RF performance into the tens of GHz.
Measured S-parameter performance demonstrates stable broadband RF behavior, low insertion loss variation, and controlled resonance characteristics across wide frequency ranges.
Figure: Measured S-parameter performance demonstrating broadband RF behavior and stable impedance characteristics across frequencies extending into the tens of GHz.
Engineered for Broadband RF Performance
The XG Series was developed specifically for applications where conventional MLCCs and traditional RF capacitors struggle to maintain stable high-frequency behavior.
Key electrical advantages include:
• Ultra-low ESL and ESR
• Reduced parasitic inductance
• High self-resonant frequency performance
• Broadband impedance stability
• Reduced RF reflections and improved matching
• Stable filtering and bypass behavior across wide frequency ranges
The result is improved RF performance, simplified filtering architectures, and more stable high-frequency system operation.
Typical Applications
• Phased array radar
• Electronic warfare systems
• SATCOM
• AI infrastructure and accelerators
• RF power amplifiers
• Microwave communications
• Aerospace and defense electronics
• High-speed digital systems
Select the Right XG Series Capacitor
XG1 Series
Best for:
- Precision RF tuning, coupling, and hybrid microelectronics.
- Single-layer RF gap capacitors optimized for high-frequency tuning, coupling, and precision microwave applications requiring stable dielectric performance and broad capacitance flexibility.
Key Features
• Single-layer RF gap capacitor
• Broad capacitance and dielectric options
• Pt or Au metallization options
• High-frequency tuning and coupling applications
• Available in compact case sizes
XG2 Series
Best for:
- Impedance matching
- RF bypass
- High-SRF applications
2-terminal embedded-electrode RF capacitors engineered for ultra-high self-resonant frequency, low inductance, and broadband RF performance.
Key Features
• Embedded-electrode capacitor architecture
• Reduced inductance and improved SRF
• Eliminates wire bonds and vias
• Broadband performance beyond 67 GHz
• Optimized for RF coupling and impedance matching
XG3 Series
Best for:
- RF filtering
- Decoupling
- PDN stability
- Broadband bypass
- EMI suppression
3-terminal ultra-low ESL RF capacitors optimized for broadband filtering, RF bypass, decoupling, and high-speed power integrity applications.
Key Features
• Extremely low ESL (<15 pH typical)
• Broadband performance from kHz to 10s of GHz
• Can replace multiple MLCCs
• Optimized for RF filtering and EMI suppression
• Stable high-frequency performance
