ST Surfilm® Series
Product Series Specifications
| General Parameters | |
|---|---|
| Type: | Multilayer Metallized Polymer Surface-Mount Film Capacitor |
| Grade: | Hi-Rel / Rugged |
| Dielectric/Construction: | Non-inductively constructed with metallized polyester dielectric, polyethylene terephthalate (PET), in a parallel plate multilayer polymer (MLP) design. Electrodes use aluminum metallization. |
| Rated Voltage: | 100 VDC / 80 VAC |
| Capacitance: | 1.0 µF and 2.2 µF @ 1 kHz |
| Sizes: | ST2824 / ST3827 chip style and ST3 / ST4 lead-frame style |
| Operating Temp: | -55 °C to +125 °C |
Overview
Paktron’s ST Surfilm® Series is a family of multilayer metallized polymer surface-mount film capacitors designed for compact, high-reliability electronic assemblies. Available in both chip-style and lead-frame-style configurations, the ST Series provides non-polarized capacitor performance in EIA chip sizes with Pb-free machined terminations and reflow solderable construction.
The ST Surfilm® Series uses a non-inductive metallized polyester dielectric in a parallel plate multilayer polymer design, supporting stable film capacitor performance in a small surface-mount package. With capacitance values of 1.0 µF and 2.2 µF, 100 VDC / 80 VAC voltage rating, and an operating temperature range of -55 °C to +125 °C, the series is well suited for compact power electronics, filtering, and high-reliability surface-mount applications.
The series includes ST2824 and ST3827 chip-style packages with tin-based solderable surfaces, as well as ST3 and ST4 lead-frame-style packages using tinned copper alloy lead frames with an “I” lead configuration for SMD butt-joint mounting.
Additional Features
- Surfilm® multilayer metallized polymer capacitor technology
- Surface-mount chip-style and lead-frame-style package options
- Pb-free machined terminations
- EIA chip sizes
- Reflow solderable construction
- Non-polarized capacitor design
- Low self-inductance performance
- Metallized polyester PET dielectric
- Parallel plate multilayer polymer construction
- Aluminum metallization electrodes
- Tin-based solderable surface for ST2824 / ST3827 chip style
- Tinned copper alloy lead-frame construction for ST3 / ST4 lead-frame style
- “I” lead configuration for SMD butt-joint mounting on lead-frame versions
- RoHS-6 compliant
- Tape-and-reel packaging
- Dry packed with desiccant in moisture barrier bag
- Moisture Sensitivity Level: MSL 4
- Made in U.S.A.
Typical Applications
- Surface-mount electronic assemblies
- Compact power electronics
- DC filtering
- High-reliability filtering applications
- Reflow-soldered circuit board assemblies
- Low-inductance capacitor applications
- Space-constrained film capacitor designs
- Board-level decoupling and filtering
- Industrial electronics
- Defense and aerospace electronics
- Mission-critical electronic systems
